CVD Diamond for Electronic Thermal Management : Quote, RFQ, Price and Buy

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The most thermally conductive bulk substance is high-purity synthetic diamond. CVD diamond adds a new level to thermal control in electronics, prolonging device lifetime, lowering device footprint, and improving efficiency and effectiveness. This is especially important for the semiconductor manufacturing process where this enables innovations for technologies like 5G, electric vehicles, the Internet of Things, artificial intelligence, and defence and security applications.

CVD diamond translates a competitive advantage in electronic thermal control where power, temperature, and reliability are essential factors.

Highest Room-Temperature Thermal Conductivity of Any Material

Heat is the single most common cause of electronic failure. Theoretically, lowering the operating junction temperature by 10° C can quadruple the life of a gadget. CVD diamond beats today's standard thermal management materials, like copper, silicon carbide, and aluminum nitride, by orders of magnitude.

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CVD diamond is available in thicknesses ranging from 250 to 1000 microns and diameters up to 140 mm. The laser cutting and polishing abilities of Element Six give clients the geometry, surface flatness, and minimal hardness that they need. The company's metallization expertise provides customers with a functional material for die bonding that has low thermal barrier resistances.

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High-Power RF devices

High-Power Optoelectronics

High Voltage Power Devices

Semiconductor Equipment

Higher Power at Lower Operating Temperature

High-power RF and optoelectronic devices can use CVD diamond for the following reasons:

CVD Diamond Heat Spreader in RF Package

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Temperature Drop Across RF Device Using CVD Diamond Heat Spreaders

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Smaller, Faster, High-Voltage Power Systems

CVD diamond delivers:

Longer Testing Time and Evenly Attached Die

By keeping device temperatures low, CVD diamond allows extensive stress testing and characterization of semiconductors. During die attachment, CVD diamond also guarantees that heat is swiftly and uniformly distributed across the whole semiconductor surface, resulting in strong and dependable contact.

Electrically Conductive CVD Diamond

DiafilmTM ETC700 combines the diamond's superior heat dissipation with reduced resistive and RF losses, allowing smaller and more dependable high-power devices without compromising electronic properties.

Compound Semiconductor Devices

The efficiency of modern devices based on GaN, SiC, InP, and GaAS can be improved and their lifespan prolonged by using DiafilmTM series heat spreaders.

Collaboration in Applications Development

The expert team of application engineers and processing specialists work alongside its clients to build the best component for the application. The eventual efficiency of a component can be accurately predicted using the most recent computer modeling technology.

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